-40%

Customize single double side FPC flex flat cable for lcd panel

$ 0.52

Availability: 77 in stock
  • Return shipping will be paid by: Buyer
  • Item must be returned within: 30 Days
  • Refund will be given as: Money Back
  • Brand: bellesign
  • Restocking Fee: No
  • Condition: New
  • All returns accepted: Returns Accepted

    Description

    Specification of Hasl Lead Free Hdi Pcb Assembly 3G mobile phone hdi pcb board manufacture mobile pcb boardr:
    Item
    Technical Specification
    Standard
    Advanced
    Number of Layers
    1-48 layer
    48-60 layer
    Laminate
    CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial.
    Thermount
    Laminate Brand
    KB,Shengyi,Nanya,Isola,Goword,grace,Rogers,
    Arlon,Taconic,Ventec
    customer specify
    Maximum board size
    610X915mm
    610x1060mm
    Board thickness
    0.15-4.5mm
    0.13-6.0mm
    Minimum line width
    4mils (1oz Cu finished)
    3mils(1oz Cu finished)
    Minimum Line gap
    4mils(1oz Cu finished)
    3mils(1oz Cu finished)
    Outer layer copper thickness
    1/3-12OZ
    12-16OZ
    Inner layer copper thickness
    1/3-14OZ
    14-16OZ
    Min. finished hole size (Mechanical)
    0.20mm
    0.15mm
    Min. finished hole size (laser hole)
    0.075mm
    0.05mm
    Aspect ratio
    10:01
    12:1
    Solder Mask Types and brand
    Nanya,Taiyo
    customer specify
    Solder Mask Color
    Gloss & matte green
    Red, Black, Yellow, Blue,white
    Impedance Control Tolerance
    10%
    5%
    Surface Treatment
    Flash Gold
    Au:1-3U''
    Au: 3U''
    Immersion Gold
    Au:2-4U''
    Au: 2-6U''
    Sn/PB HASL
    Sn:100-1000U''
    Sn: 200-800U''
    Leadfree HASL
    Sn:100-1000U''
    Sn: 200-800U''
    Immersion Silver
    Ag: 0.15um-0.75um
    /
    OSP (Entek)
    Thicknes: 0.20-0.50um
    /
    Hard Gold Finger
    Au: 30U''
    Au:30-60U''
    Hard Gold Plating
    Au-30U''
    Au:30-60U''
    Carbon ink
    Immsion Sn
    Sn:0.8-1.2um
    V-Cut
    V-cut degree
    30+/-5 degree
    20,45, 60 Degree
    Tol: +/-0.13mm
    Tol: +/-0.10mm
    Chamfer
    The angle type of
    the chamfer
    20,30, 45 Degree
    /
    Plug via hole
    Min. size can be plugged
    0.15mm
    /
    Max. size can be plugged
    0.50mm
    0.70mm
    Largest NPTH hole size
    6.50mm
    Multi-hit(not limited)
    Largest PTH hole size
    6.50mm
    Multi-hit(not limited)
    Min. annular ring can be kept
    6mils
    4 mils
    Min. distance between the IC pads can keep SM bridge
    8mils
    7mils
    Min. SM bridge for green soldermask
    4 mils
    3 mils
    Min. SM bridge for black soldermask
    5mils
    4mils
    Tolerance of dimension size
    Tol: +/-0.13mm
    Tol: +/-0.10mm
    Tolerance of board thickness
    T>=1.0mm, Tol: +/-10%
    T<1.0mm, Tol:+/-0.1mm
    T>=1.0mm, Tol: +/-5%
    T<1.0mm, Tol:+/-0.1mm
    Tolerance of finished PTH hole size
    Tol: +/-0.075mm
    Tol: +/-0.05mm